HDI PCB with BGA, Blind and Buried via, Made of FR4 Material 1.UL,SGS,ROHS,IS09001,CE,IPC 2.. ... quality&competitive price HDI PCB with BGA, Blind and Buried via, Made of FR4 Material1.Base Material:fr42.copper thickness:2oz3.board ... thickness:1.6mm4.Surface treatment:ENIG5.layer:4-layerproductive power: Specification ...